Hardware · Firmware · PCB · Manufacturing · Packaging
From schematic to shipped board.
Board-level engineering for teams who can't afford a re-spin. We design, lay out, and manufacture complex hardware — high-speed digital, RF, mixed-signal, power — and we own the path from prototype through production.
Trusted by industry leaders
Services
Five practices, one engagement.
Most projects engage two or three. We run them on one team so the handoffs don't lose the design intent.
- 01
Hardware Engineering
Board-level design for systems where signal integrity, power, and thermals are non-negotiable.
- 02
Firmware & Embedded Systems
Bare-metal and RTOS firmware on ARM, RISC-V, and Espressif — from board bring-up to OTA.
- 03
PCB Design & Layout
Two to seventy-six layers, including HDI, flex, rigid-flex, and high-speed — with SI/PI built into the routing, not bolted on at the end.
- 04
Manufacturing & Assembly
Prototype to production, SMT and through-hole, with sourcing and quality systems in the same engagement.
- 05
Packaging, Test & Failure Analysis
Quick-turn packaging, reliability qualification, and failure analysis built for NPI: one team from first silicon to a qualified part on a working board.
What we ship into
- DDR5
- PCIe Gen 5
- RF / mmWave
- HDI
- Rigid-flex
- 1–76 layers
- SMT & through-hole
- Turnkey
- Ceramic & plastic packaging
- Reliability qual
- FIB / failure analysis
Boards for compute, networking, RF, sensing, and power across semiconductors, defense, industrial, and medical, plus quick-turn packaging and test for silicon teams. Engagements scoped by board complexity, not by hours.
Engage
Start with the board, not the brief.
Tell us what the board is, what it has to do, and what's already been tried. We'll come back with scope, timeline, and the team — not a deck.